4Great reasons to buy from us:
-
30-Day Money-Back Guarantee
Changed your mind? Ordered the wrong thing? Simply return your item for a prompt exchange or refund. -
Free Shipping Over $70
Enjoy free shipping when you spend over $70 -
Secure Checkout
SSL Protected Checkout & Strongly Secure for Payments -
Fast Handling
Every order is a priority to us. We handle your order quickly to ensure you get your product fast.
1. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep
2. 183 degrees three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard
3. For iPhone 12 series
4. Also supports CPU, hard disk IC, baseband IC degumming
5. Professional repair tools aim to give assistance during device repairing.
6. Through the unique bonding function of the welding platform, the upper and lower layers of the motherboard can become more standard when bonding
2. 183 degrees three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard
3. For iPhone 12 series
4. Also supports CPU, hard disk IC, baseband IC degumming
5. Professional repair tools aim to give assistance during device repairing.
6. Through the unique bonding function of the welding platform, the upper and lower layers of the motherboard can become more standard when bonding
Specification:
| Package Weight |
|
| Shipping | This item ships to |
| Delivery | Estimated between and . Will usually ship within 1 business day. |
Description
1. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep
2. 183 degrees three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard
3. For iPhone 12 series
4. Also supports CPU, hard disk IC, baseband IC degumming
5. Professional repair tools aim to give assistance during device repairing.
6. Through the unique bonding function of the welding platform, the upper and lower layers of the motherboard can become more standard when bonding
2. 183 degrees three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard
3. For iPhone 12 series
4. Also supports CPU, hard disk IC, baseband IC degumming
5. Professional repair tools aim to give assistance during device repairing.
6. Through the unique bonding function of the welding platform, the upper and lower layers of the motherboard can become more standard when bonding
Specification:
| Package Weight |
|
Shipping
| Shipping | This item ships to |
| Delivery | Estimated between and . Will usually ship within 1 business day. |
Item Added to Your Cart
Customers also bought...
Item Added to Your Cart
Customers also bought...
Item Added to Your Cart
Customers also bought...
Related Products
SAVE $31.50
SAVE $62.95
SAVE $6.14
3
visitors right now
3
visitors have this item in their cart right now
3
people have bought this item
3
% of people buy 2 or more